Unboxing Review of the Scythe Fumasan SCFM-3000 Twin Tower Air-Cooled Radiator III

The latest iteration of the “Feng Mo” master has made a quiet appearance! Scythe continues to maintain the dual-tower design, complemented by dual fans and six Ø6 mm heat pipes. However, the height of the tower body has been slightly reduced from the original 154.4 mm to 154 mm. The optimized offset design makes Scythe the most user-friendly option in terms of hardware compatibility during the installation process.

Scythe SCFM-3000 Specifications:
Color: Black
Intel Pins: LGA 2066 / 2011(V3) / 1700 / 1200 / 115X
AMD Pins: AM5 / AM4
Dimensions (including fan): 138 x 128 x 154 mm
Number of Heatpipes: Ø6 mm x6
pre-attached fans: KazeFlex II 120 PWM, KazeFlex II 120 Slim PWM
Fan speed: 200~1500 ± 10% RPM
Air volume: 16.9~67.62 CFM, 8.16~39.44 CFM Air
pressure: 0.075~1.5 mm-H2O, 0.045~ 0.96 mm-H2O
fan connection interface: PWM 4-Pin
Product Warranty: Three years

Scythe SCFM-3000 dual-tower air-cooled radiator out of the box

This year, Scythe has refreshed its premier air-cooled radiator line with the introduction of the new-generation Fengma series, known as the “Fengmasan SCFM-3000.” This model is compatible with the latest Intel LGA 1700 and AMD AM5 platform pins, making it suitable for current installations and use. The 154 mm tall twin-tower body comes with two fans: KazeFlex II 120 PWM and KazeFlex II 120 Slim PWM. Moreover, an optimized offset design has been incorporated to prevent any conflicts during installation between the motherboard and memory.

Currently, the Taiwanese sales channel “Original Price House” is offering Fengmo San at NT$1590, a price that is consistent with previous generations of Fengma series radiators. This pricing essentially places the upper budget limit within the range of 1,500 yuan, making the 1,000 to 1,500 yuan price bracket a highly competitive zone for various air-cooling towers.

Scythe Fuma 3/Fuma 3/ FUMA 3.
Various product features.
The size chart is provided for players’ reference.

The Fengmosan package includes the following components:

  • KazeFlex II 120 PWM fan
  • KazeFlex II 120 Slim PWM fan
  • Tower body (loose)
  • Long screwdriver
  • PWM cable
  • Thermal grease
  • Spatula
  • HPMS V fifth-generation mounting bracket set.
List of contents.
The thermal grease included in the Fengmosan package can be applied approximately four times. Its texture is relatively thin and watery, making it easy to apply.
PWM One point two wires, three sets of fan wire fasteners.
The fan wire is fixed quite firmly.

Fengmosan continues to feature the structure of two towers and six heat pipes, each with a diameter of 6 mm. The height has been slightly reduced to 154 mm compared to the previous generation, aligning with the trend toward higher growth. Optimum installation compatibility is achieved through an optimized offset design.

The thin tower block has noticeable bends closer to the center of the fixed part, a design decision made to provide as much memory installation space as possible. The rear tower body’s second half has fins hollowed out upwards, and as the heatsink of the rear I/O on the motherboard isn’t as pronounced as the memory, only a slight increase in installation space is required.

When it comes to installation, it’s recommended to mount the KazeFlex II 120 Slim PWM thin fan in front of the slim tower, positioning it to face the side where the memory is located. Actual installation tests show that even with memory expansion in the first slot, there is no obstruction. This configuration ensures more convenience for future memory replacement or upgrading.

The size of Fengmasan is 138 x 128 x 154 mm, maintaining the structure of two towers and six heat pipes.
The offset display of the twin towers.
Actual installation demonstration with T-Force DELTA RGB DDR5 6200 MT/s 16GBx2 installation demonstration.

The top of the Tasan includes a decorative cover, which conceals the heat pipes, offering a visual appeal much superior to having the heat pipes directly exposed. All the components such as the heat pipes, cooling fins, and screws have been nickel-plated. The attention to these details and the overall texture is consistent with the careful design features that have come to be associated with the Scythe brand.

The Scythe logo adorns the top cover.
Close-up of heat dissipation fins through FIN process.
Nickel-plated heat pipes are shown.

The bottom contact surface of Fengmasan is designed as a vapor chamber, and it comes with a transparent protective film attached to prevent scratches during manufacturing or shipping. Users must remember to remove this transparent protective film before installing the tower, ensuring proper contact and thermal performance.

Pre-applied protective stickers.
Semi-matte vapor chamber.

Fengmao 3 features a dual-tower design with two fans, including a KazeFlex II 120 PWM and a KazeFlex II 120 Slim PWM. These fans can reach a full speed of up to 1500 RPM. Scythe has implemented some innovative details in the fan design. For example, the thicker KazeFlex II 120 PWM is a reverse-bladed fan, meaning Fengmasan uses two fans with different rotational directions to concentrate the airflow more efficiently.

To prevent resonance and abnormal noise, the two fans are equipped with vibration-damping pads at the four corners on both sides. Connection to the motherboard is achieved through a PWM 4-Pin braided wire, and the accessories include PWM 1-2-2 wires, allowing them to be used together. These thoughtful features enhance the performance and user experience of the product.

KazeFlex II 120 Slim PWM and KazeFlex II 120 PWM.
KazeFlex II 120 Slim PWM is a 15 mm thick thin fan.
The fan is powered by a PWM braided wire.

For installation, Fengmao 3 utilizes the newly designed HPMS V fifth-generation fastener, comprising a metal backplate and specialized fasteners for both Intel and AMD. The HPMS V fifth-generation fastener system is paired with different fixing plates, foot positions, and screws depending on the installation platform. Therefore, it’s recommended that users carefully read the manual before installing to ensure proper alignment and a successful installation process.

Display of HPMS V five-generation fastener set.
There is a groove for screwdriver fixing on the tower body. After the screws are fixed, install the fan in the middle.
The installation display with the heat sink on the back of the motherboard.
Leave a lot of distance from the heat sink above the motherboard.

Scythe SCFM-3000 heat dissipation performance test

Scythe’s air-cooled tower radiator design, featuring two towers, two fans, and six heat pipes, doesn’t allow for as aggressive cooling configurations as water-cooled systems. For testing, the Intel platform utilizes an i7 13700 processor with a BIOSTAR Z790 VALKYRIE motherboard, while the AMD platform employs a Ryzen 9 7950X with an ASRock B650E Taichi motherboard.

Due to the unique nature of the PBO (Precision Boost Overdrive) mechanism on the AMD platform, testing can yield different results based on factors like physical fitness. Therefore, the author has chosen to set PBO to “Auto” for the measurements, providing a more standardized testing environment.

Here’s a detailed description of the test platforms and the conditions under which they were tested:

Intel Test Platform

  • Processor: Intel Core i7 13700
  • Cooler: Scythe SCFM-3000
  • Motherboard: BIOSTAR Z790 VALKYRIE (BIOS version: Z79AC510)
  • Memory: T-Force DELTA RGB DDR5 6200 MT/s 16GBx2
  • Graphics Card: NVIDIA GeForce RTX 4070 Founders Edition
  • Operating System: Windows 11 Pro 21H2
  • Power Supply: FSP Hydro G PRO ATX3.0 (PCIe5.0) 850W

AMD Test Platform

  • Processor: AMD Ryzen 9 7950X (PBO Auto)
  • Motherboard: ASRock B650E Taichi (BIOS Version: 1.28 .AS01 [Beta])
  • Radiator: Scythe SCFM-3000
  • Memory: T-Force VULCANα DDR5 5600 MT/s CL40 8GBx2
  • Graphics Card: NVIDIA GeForce RTX 4070 Founders Edition
  • Operating System: Windows 11 Professional 21H2
  • Power Supply: FSP Hydro G PRO ATX3.0 (PCIe5.0) 850W

The test platforms were placed on a bare test frame and tested in an air-conditioned room maintained at 27 °C. The fan operation mode was set to full speed, and the tests were conducted using various software like Fire Strike, AIDA64 CPU, AIDA64 FPU, and R23 multi-core. These tests simulated various usage scenarios including gaming, rendering, and extreme load situations.

Intel Platform Results:

  • In daily gaming and application tests with the i7 13700 processor, the maximum temperatures reached about 83 °C and 86 °C, respectively.
  • In processor rendering, power consumption reached up to 186W, and the maximum temperature approached 100 °C in AIDA64 FPU projects, even causing overheating throttling.

AMD Ryzen 9 7950X Results (PBO Auto):

  • Fire Strike and AIDA64 CPU temperatures did not exceed the temperature wall set by the motherboard.
  • Under extreme load, the temperature exceeded 95 °C, but the frequency was uniformly maintained at AMD Ryzen 9 7950X 5.5 GHz.

These results provide valuable insights into the cooling performance of the Scythe SCFM-3000 in various scenarios and highlight the specific behaviors of both Intel and AMD platforms under different types of loads.


Scythe’s latest flagship, the SCFM-3000 twin-tower air-cooled radiator, showcases a subtle evolution in appearance and texture compared to its predecessor. The included KazeFlex II fans, consisting of KazeFlex II 120 PWM and KazeFlex II 120 Slim PWM, complement the design well. Even at full speed, these fans maintain a relatively quiet operation, which aligns perfectly with the “Fengma” theme, meaning silent and stealthy.

The SCFM-3000 still features the dual towers, dual fans, and six heat pipes from the previous design but trims down the height slightly from 154.4 mm to 154 mm. It also integrates a thoughtful design that maximizes compatibility with motherboard and memory heatsink space, ensuring optimal installation. The design further supports the latest LGA 1700 and AM5 pin installations.

In terms of cooling performance, the SCFM-3000 is most effective around the 180W power consumption mark. With an Intel i7 or Ryzen 9 processor, it provides ample cooling for gaming or daily tasks. However, for those looking to push their processors under extreme loads, water cooling might be a preferable option. For users interested in pairing the SCFM-3000 with their processor for rendering tasks, an Intel i5 13600K might be a more suitable and balanced choice, aligning well with the cooler’s capabilities.

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Title: Unboxing Review of the Scythe Fumasan SCFM-3000 Twin Tower Air-Cooled Radiator III